Resin bonding diamond wheel 14F1

diamond grinding wheel for sapphire wafer is our main products in UNIOn grinding wheel department. Welcome to have a visit.
 diamond grinding wheel for sapphire wafer
Characteristics:
the grinding wheel for LED substrate are mainly used for back thinning of sapphire epitaxial wafer, silicon wafer,gallium aresenide and GaN wafer.
Application:
1.grindingwheelsforLEDsubstrate 
2.excllentquality. 
3,steadyworking 
4.longlifetime. 
5. high performance 
DiamondGrinding (used for silicon ingot sapphire, SiC, GaN etc. High-material surface grinding)
According to the characteristics of the processed materials. Resin, metal, Vitrified and electroplated bond with the grinding wheel types to choose from. we can provide the different size if you have different need.
Grinding wheel for LED substrate are mainly used for back thinning of sapphire epitaxial wafer, silicon wafer,gallium aresenide and GaN wafer.
Resin bonding diamond wheel 14F1